学術論文 |
- "Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distribution on PCBs," IEEE Electromagnetic Compatibility Magazine, vol.11, no.3, pp84-92, 11 Dec. 2022
- Young Woo Kim, Daisuke Fujimoto, Yuichi Hayashi
- "Evaluation of Statistical Fault Analysis Using Input Timing Violation of Sequential Circuit on Cryptographic Module Under IEMI," IEEE Transactions on Electromagnetic Compatibility, vol.65, no.1, pp51-57, Oct. 2022
- Daisuke Fujimoto, Takumi Okamoto, Yang Li, Young Woo Kim, Yuichi Hayashi
- "A Novel Remote Visualization of Screen Images Against High-Resolution Display with Divided Screens Focusing on the Difference of Transfer Function of Multiple Emanations," IEEE Transactions on Electromagnetic Compatibility, vol.99, pp1-8, Sep. 2022
- Taiki Kitazawa, Kimihiro Arai, Young Woo Kim, Daisuke Fujimoto, Yuichi Hayashi
 [ doi:10.1109/TEMC.2022.3204357 ]
- "Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates," Micromachines, vol.13(9), no.1433, pp1-18, Aug. 2022
- Young Woo Kim
[ doi:10.3390/mi13091433 ]
- "A Novel FDTD Approach Considering Frequency Dispersion of FR-4 Substrates for Signal Transmission Analyses at GHz Band," Transactions on Electromagnetic Compatibility, vol.99, pp1-11, May. 2022
- Taiki Kitazawa, Taiki Yamagiwa, Ren Kitahara, Young Woo Kim, Jerdvisanop Chakarothai, Yuichi Hayashi, Takashi Kasuga
[ doi:10.1109/TEMC.2022.3175376 ]
- "Channel Characteristic-based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer," IEEE Transactions on Electromagnetic Compatibility, vol.64, no.1, pp196-208, Feb. 2022
- Daehwan Lho, Hyunwook PArk, Sinyoung Park, Hyungmin Kang, Boogyo Shim, Junyong Park, Kyungjun Cho, Jinwook Song, Seongguk Kim, Young Woo Kim, Joungho Kim
[ doi:10.1109/TEMC.2021.3081713 ]
- "Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.11, no.11, pp1944-1970, Nov. 2021
- Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daewhan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Seongtaek Jeong, Young Woo Kim, Joungho Kim
[ doi:10.1109/TCPMT.2021.3117071 ]
- "Measurement and Analysis of Electromagnetic Information Leakage from Printed Circuit Board Power Delivery Network of Cryptographic Devices," IEEE Transactions on Electromagnetic Compatibility, vol.63, no.5, pp1322-1332, Oct. 2021
- Shinpei Wada, Yuichi Hayashi, Daisuke Fujimoto, Naofumi Homma, Young Woo Kim
[ doi:10.1109/TEMC.2021.3062417 ]
- "Measurement and Analysis of Through Glass Via (TGV) Noise Coupling and Shielding Structures in a Glass Interposer," IEEE Transactions on Electromagnetic Compatibility, vol.63, no.5, pp1562-1573, Oct. 2021
- Gapyeol Park, Young Woo Kim, Kyungjun Cho, Junyong Park, Insu Hwang, Jihye Kim, Kyungjune Son, Hyunwook Park, Atom O. Watanabe, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
[ doi:10.1109/TEMC.2021.3059846 ]
- "A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System," TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, vol.63, no.3, pp935-946, 11 Jun. 2021
- Boogyo Sim, Seungtaek Jeong, Young Woo Kim, Shinyoung Park, Seongsoo Lee, Seokwoo Hong, Jinwook Song, Hongseok Kim, Hyungmin Kang, Hyunwook Park, Daehwan Lho, Joungho Kim
[ doi:10.1109/TEMC.2020.3039412 ]
- "Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure," IEEE Transactions on Microwave Theory and Techniques, vol.68, no.12, pp5055-5064, Dec. 2020
- Young Woo Kim, Gapyeol Park, Kyungjun Cho, Pulugurtha Markondeya Raj, Rao R. Tummala, Joungho Kim
[ doi:10.1109/TMTT.2020.3022009 ]
- "Statistical Eye-Diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers," IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, vol.62, no.6, pp2547-2557, Dec. 2020
- Young Woo Kim, Junyong Park, Joungho Kim, Yuichi Hayashi
[ doi:10.1109/TEMC.2020.2975202 ]
- "Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.10, no.5, pp858-869, May. 2020
- Kyungjune Son, Kyungjun Cho, Subin Kim, Shinyoung Park, Daniel H. Jung, Junyong Park, Gapyeol Park, Seongguk Kim, Taein Shin, Young Woo Kim, Joungho Kim
[ doi:10.1109/TCPMT.2020.2984268 ]
- "Segmentation method based modeling and analysis of a glass package power distribution network (PDN)," Nonlinear Theory and Its Applications, IEICE, vol.11, no.2, pp170-188, Apr. 2020
- Young Woo Kim, Daisuke Fujimoto, Shugo Kaji, Shinpei Wada, Hyunwook Park, Daehwan Lho, Joungho Kim, Yuichi Hayashi
[ doi:10.1587/nolta.11.170 ]
- "Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.10, no.3, pp467-478, Mar. 2020
- Hyunwook Park, Junyong Park, Subin Kim, Kyungjun Cho, Daehwan Lho, Seungtaek Jung, Shinyoung Park, Gapyeol Park, Boogyo Sim, Seongguk Kim, Young Woo Kim, Joungho Kim
[ doi:10.1109/TCPMT.2020.2972019 ]
- "Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling," IEEE Transactions on Electromagnetic Compatibility, vol.61, no.6, pp1867-1875, Dec. 2019
- Junyong Park, Shinyoung Park, Young Woo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, Joungho Kim
[ doi:10.1109/TEMC.2019.2951775 ]
- "A Frequency Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems using Resonant Frequency Control of a Shielding Coil in Smartphone Application," IEEE Transactions on Electromagnetic Compatibility, vol.61, no.6, pp2031-2039, Dec. 2019
- Seokwoo Hong, Young Woo Kim, Seungtaek Jeong, Boogyo Shim, Hongseok Kim, Seungyoung Ahn, Joungho Kim
[ doi:10.1109/TEMC.2019.2951775 ]
- "Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling," IEEE Transactions on Electromagnetic Compatibility, vol.Early Access, no.99, pp1-9, Mar. 2019
- Junyong Park, Shinyoung Park, Young Woo Kim, Gapyeol Park, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Seongsoo Lee, Dong-Hyun Kim, Joungho Kim
- "Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC," Transactions on Components, Packaging and Manufacturing Technology, vol.61, no.4, pp317-328, Feb. 2019
- Subin Kim, Young Woo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim
- "Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.9, no.2, pp317-328, Feb. 2019
- Subin Kim, Young Woo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim
- "Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.9, no.1, pp107-121, Jan. 2019
- Kyungjun Cho, Young Woo Kim, Hyunsuk Lee, Jinwook Song, Junyong Park, Seongsoo Lee, Subin Kim, Gapyeol Park, Kyungjune Son, Joungho Kim
- "Fast and Accurate Power Distribution Network (PDN) Modeling of A Silicon Interposer for 2.5-D/3-D ICs with Multi-array TSVs," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.Early Access, no.99, pp1-12, Jan. 2019
- Kyungjun Cho, Young Woo Kim, Subin Kim, Hyunwook Park, Junyong Park, Seongsoo Lee, Daeyong Shim, Sangmook Oh, Joungho Kim
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